Test Probes
Wafer Mapping / Die Sort
LD Microprecision has achieved breakthrough in ultrafine micro-machining process capability in the design and manufacturing of test probes for wafer sort / mapping. Using our special design equipment, we are able to produce this high performance probes with tight tolerance specification to ensure effective and long lasting applicaiton.
Description
Probes needles materials both plated and unplated type are used with diameters from 0.2mm (8mil) to 0.7mm (28mil). We are able to achieve ultra fine tip of radius as small as 6 microns.
- Tungsten
- Tungsten Rhenium
- Beryllium Copper
- Tungsten Carbide
- Paliney
By applying specially developed process(es) we are able to solder and control the “blade” to the probe needle dimension to within 10 microns. The blade finishing can either nickel or gold plate.
