Epoxy Dispensing Nozzle

In die bonding, epoxy deposition onto the substrate prior to die placement is very critical and challenging especially when it is prone to “delamination” resulting in the product reliability or even failure. Poor or incomplete epoxy dispensing with voids will create trapped gases during curing between the substrate and beneath the die. It should be avoided.

We optimize the dispensing nozzles design in both patterns and tubing size selections that can voids. Other design considerations include controlling the amount of epoxy deposition limit the fillet height of less 50% of die thickness.